flip-chip and advanced packaging. They just need larger-scale production capabilities, but not in all areas. “The most likely increased volume enablement in the U.S. will be devices built with leading ...

The funds will enable new technologies to be validated and transitioned at scale.

The awards target two key areas: advanced substrates and materials research, and a brand-new facility for piloting and ...

RRP Electronics is already working on the production of sophisticated Application-Specific Integrated Circuits (ASICs) in QFN ...

Chip scale devices on a penny by Cp82 CC-BY-SA 3.0 In November, they plan to order a multiproject wafer with 40 slots ... 100 to 300 chips in chip-scale packaging (CSP). You can see a typical ...