And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?

Apple is apparently moving to fan-out packaging, according to analysts ... One ultra-thin package type is called a wafer-level chip-scale package (CSP). “Wafer-level CSP is fan-in,” said William Chen, ...

This battle has been waged for a long time, especially with the introduction of wafer-scale packaging. So whether you know it or not, package technology has been shifting back and forth between ...

Chip scale devices on a penny by Cp82 CC-BY-SA 3.0 In November, they plan to order a multiproject wafer with 40 slots ... 100 to 300 chips in chip-scale packaging (CSP). You can see a typical ...

TSMC introduced "Wafer Manufacturing 2. ... Tongfu Microelectronics' advanced packaging initiatives, including a CNY7.5 billion facility, aim for full-scale operations by 2029.

25, 2020 -- Synopsys, Inc. (Nasdaq: SNPS) today announced that Synopsys and TSMC have collaborated to deliver certified design flows for advanced packaging solutions using the Synopsys 3DIC Compiler ...

Apple has decided to wait until 2026 to incorporate TSMCs 2nm chips into the iPhone 18. The move bypasses the iPhone 17, as ...