The US Administration unveils tough new restrictions on the export of advanced computer chips and other AI technology.

HighTec EDV-Systeme, a provider of automotive C/C++ compiler solutions, has announced that it has added support for Nuclei ...

The ESPR and its varied requirements are set to significantly impact a variety of industries and business operations.

The additions include the G9EK-1-UTU and G9EK-1-E which provide compact yet high-capacity gasless interruption for large ...

NXP has secured a €1 billion loan from the European Investment Bank (EIB) to advance the company’s RDI investment.

Quantum Science has secured grant funding to further expand its work on QDs for high-speed imaging and sensing.

Vertical Compute raises funds to develop vertical integrated memory and compute technology to tackle AI memory issues.

The SiT5977 replaces multiple timing components and optimises the efficiency of AI compute clusters with 3X tighter ...

Based on Qualcomm Technologies’ Snapdragon Auto Connectivity Platform and the QCA6797AQ, the industry’s first automotive grade Wi-Fi 7 access point solution, the RUBY-W2 series supports 2x2 MIMO Multi ...

Infineon Technologies breaks ground for a new semiconductor backend production site in Samut Prakan, south of Bangkok.

Hirose has expanded its FPC-to-board product offering to include a two-piece harsh environment connector that simplifies ...

Allegro MicroSystems has announced the launch of two new current sensor ICs - the ACS37030MY and the ACS37220MZ.