Instruction Alignment in Large Language Models for Chip Design via Geodesic Interpolation” was published by researchers at ...

A new technical paper titled “Superconductivity from Domain Wall Fluctuations in Sliding Ferroelectrics” was published by ...

A new research paper titled “Thickness-dependent polaron crossover in tellurene” was published by researchers from Rice ...

A new technical paper titled “Leveraging ASIC AI Chips for Homomorphic Encryption” was published by researchers at Georgia ...

But it could help with mundane tasks, freeing up designers to focus on more intricate problems.

Traditional 2D EDA flows are insufficient for multi-die designs, requiring advanced parasitic extraction, power analysis, and ...

Despite the buzz, a study of 500 technology professionals in the data center field revealed only 42% are up to speed with ...

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how ...

Examples of how Intel and Google used Calibre DesignEnhancer to enhance their design flows, boost power integrity, and achieve superior IC designs faster. The importance of a flexible, ...

New methodology for early-stage and life cycle design that quantifies the impact of simulation on sustainability initiatives.

Fig. 1: The industry roadmap for the transition of substrates from organic (top) to glass (bottom) and the path to 1µm L/S.

Collectively, that makes screening for process defects in interposer interconnects and micro-bumps much more difficult.