And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?

flip-chip and advanced packaging. They just need larger-scale production capabilities, but not in all areas. “The most likely increased volume enablement in the U.S. will be devices built with leading ...

Apple is apparently moving to fan-out packaging, according to analysts ... One ultra-thin package type is called a wafer-level chip-scale package (CSP). “Wafer-level CSP is fan-in,” said William Chen, ...

The funds will enable new technologies to be validated and transitioned at scale.

RRP Electronics is already working on the production of sophisticated Application-Specific Integrated Circuits (ASICs) in QFN ...

The awards target two key areas: advanced substrates and materials research, and a brand-new facility for piloting and ...

25, 2020 -- Synopsys, Inc. (Nasdaq: SNPS) today announced that Synopsys and TSMC have collaborated to deliver certified design flows for advanced packaging solutions using the Synopsys 3DIC Compiler ...

TSMC introduced "Wafer Manufacturing 2. ... Tongfu Microelectronics' advanced packaging initiatives, including a CNY7.5 billion facility, aim for full-scale operations by 2029.

Overview: Xintec Inc. is a wafer level chip scale packaging company with operations in Asia, the United States, and Europe, and has a market capitalization of NT$52.51 billion. Operations: The company ...