The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

The 21st Century is all about innovations, technology and the world of AI. Keeping with all these, Acer Laptops are the ...

Genesis Fertilizers has signed Process Design Package (PDP) and License agreements with Stamicarbon, the nitrogen technology ...

The device paves the way for a new era of ultrafast computing, say researchers.

K2 Systems, a solar mounting system solutions provider, has integrated K2 Quote directly the Aurora platform. This will let ...

A vexing problem has long confronted quantum computer designers: the need to keep bits in a superconducting quantum processor ...

HOKU Design Group, founded by brand strategist KyAlea Monma, transforms client companies into cohesive, authentic brands that ...

Armed with a 3D concrete printer, careful measuring tools, and just the right ingredients, a team at The University of New ...

Thomson Industries, Inc. has announced a significant upgrade to its stepper motor linear actuator (SMLA) online selector tool ...

We have elected to go with a project delivery method called 'Construction Management as Contractor,'” said Monterey Regional ...

Proven AI and HPC ASIC Design Flow Production-ready 3DIC cross-section Alchip’s newly available 3DIC design flow addresses ...

An eFPGA is an FPGA that’s embedded into an ASIC to provide one or more programmable-logic fabrics for flexibility and ...