Qualcomm's new chip packaging deal with UMC could upset TSMC
Chip packaging helps protect the SoC from potential damage related to corrosion and other situations. However, the most ...
Indiatimes9d
Apple’s M5 chips may have a new design: How can it improve next-gen iPhones and Macs
Apple is expected to revolutionize its chip design by incorporating a new packaging technology called SoIC-mH in the upcoming M5 Pro, M5 Max, and M5 Ultra chips. Mass production is anticipated to ...
SiliconANGLE9d
Report: Apple’s M5 chips will use TSMC’s N3P process and 2.5D packaging technologies
Apple will reportedly assemble the high-end M5 chips using 2.5D packaging. This is a chip design approach that places a processor’s compute modules atop a common base layer, or interposer.
BGR1y
Apple will begin producing and packaging some Apple Silicon chips in the US
If you buy through a BGR link, we may earn an affiliate commission, helping support our expert product labs. Today, Apple announced that some of its most advanced silicon production and packaging ...