Apple is expected to revolutionize its chip design by incorporating a new packaging technology called SoIC-mH in the upcoming M5 Pro, M5 Max, and M5 Ultra chips. Mass production is anticipated to ...

After all, there are multiple factors that go into the performance of a SoC, making it a success or directly ruining a good design. Chip packaging technology is one of the main keys, and TSMC also ...

Apple will reportedly assemble the high-end M5 chips using 2.5D packaging. This is a chip design approach that places a processor’s compute modules atop a common base layer, or interposer.

MOUNTAIN VIEW, Calif., Aug. 25, 2020 -- Synopsys, Inc. (Nasdaq: SNPS) today announced that Synopsys and TSMC have collaborated to deliver certified design flows for advanced packaging solutions using ...