Summary Ensuring the quality of silicon and organic interposers is increasingly challenging as chiplet density and processing demands rise. Complex 3D stacks amplify defects, thermal effects, and ...
Summary Recent breakthroughs in quantum computing showcase its transformative potential, with Google's Willow and China's Zuchongzhi 3.0 achieving quantum advantage. Despite challenges like qubit ...
Intel to spin off venture capital arm as chipmaker continues to restructure: Summary Intel plans to spin off its $5 billion venture arm, Intel Capital, as an independent firm by l ...
Summary Compal Electronics, a major Taiwanese notebook maker, is eyeing Texas for U.S. investments, citing its independent electricity grid and strategic location. Compal aims to expand AI server ...
Summary Nvidia faces a major revenue challenge as new U.S. export restrictions on AI chips target global distribution, cutting off key markets like China, which accounts for 17% of its sales. Analysts ...
Innovations like photo imageable dielectric materials and liquid photoresist offer potential, yet glass substrates emerge as a more promising solution for achieving sub-1.5µm L/S technology.
Summary The semiconductor industry is undergoing transformative challenges fueled by AI, cloud computing, and economic electrification. Moore’s Law’s slowdown drives innovations like 3D chiplets and ...
Rapidus tackles three major challenges; initial production yield target set at 50%: Summary Rapidus is gearing up to supply Broadcom with 2nm chip prototypes by June 2025, paving ...
Summary Semiconductor Engineering experts explored design-for-testability (DFT) trends with leaders from Teradyne, Synopsys, Advantest, and Siemens EDA. D ...
Biden's chip strategy highlights TSMC over Intel as his term approaches its end: Summary Following the 2024 US presidential election, tensions flare as Biden and Trump teams excha ...