RRP Electronics is already working on the production of sophisticated Application-Specific Integrated Circuits (ASICs) in QFN ...

flip-chip and advanced packaging. They just need larger-scale production capabilities, but not in all areas. “The most likely increased volume enablement in the U.S. will be devices built with leading ...

The funds will enable new technologies to be validated and transitioned at scale.

Apple is apparently moving to fan-out packaging, according to analysts ... One ultra-thin package type is called a wafer-level chip-scale package (CSP). “Wafer-level CSP is fan-in,” said William Chen, ...

And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?

The awards target two key areas: advanced substrates and materials research, and a brand-new facility for piloting and ...

TSMC introduced "Wafer Manufacturing 2. ... Tongfu Microelectronics' advanced packaging initiatives, including a CNY7.5 billion facility, aim for full-scale operations by 2029.

25, 2020 -- Synopsys, Inc. (Nasdaq: SNPS) today announced that Synopsys and TSMC have collaborated to deliver certified design flows for advanced packaging solutions using the Synopsys 3DIC Compiler ...