The approach, which has been around for several years, is a wafer-level packaging process that enables ultra-thin, high-density packages. So why the buzz? Apple is apparently moving to fan-out ...

Two years ago, at the annual IMAPS conference on 2.5D and 3D chip packaging, the presentations were dominated by talk of fan-out wafer-level packaging. There was almost no talk of through-silicon vias ...

and a variety of new fan-out processes. The announcement today is a realization of a vision where ultimately, we can provide SkyWater and other leading advanced packaging customers with the widest ...

TSMC introduced "Wafer Manufacturing 2.0" in July 2024, integrating packaging, testing, and photomask production into its ...

fan-out wafer level packaging (FOWLP) technology in partnership with Deca Technologies 'Deca'. Shrinking line width and spacing in advanced packaging drives new polymer materials that require low ...

and a variety of new fan-out processes. The announcement today is a realization of a vision where ultimately, we can provide ...