Two years ago, at the annual IMAPS conference on 2.5D and 3D chip packaging, the presentations were dominated by talk of fan-out wafer-level packaging. There was almost no talk of through-silicon vias ...

The approach, which has been around for several years, is a wafer-level packaging process that enables ultra-thin, high-density packages. So why the buzz? Apple is apparently moving to fan-out ...

and a variety of new fan-out processes. The announcement today is a realization of a vision where ultimately, we can provide SkyWater and other leading advanced packaging customers with the widest ...

"The Deca RapidCure technology has been a significant complementary addition to our cure and materials engineering ...

and high-density wafer-level RDL-based Integrated Fan-Out (InFO-R) designs. 3DIC Compiler provides packaging design solutions required by today's complex multi-die systems for applications like ...

fan-out wafer level packaging (FOWLP) technology in partnership with Deca Technologies 'Deca'. Shrinking line width and spacing in advanced packaging drives new polymer materials that require low ...