One way around this problem is to replace silicon with graphene-like 2D materials that maintain their semiconducting ...

Laser ablation results in smaller chipping on both the top and bottom sides of the die, as well as a narrower kerf width.

SK Group's silicon wafer manufacturer SK Siltron has confirmed that it will receive a loan of US$544 million from the US Department of Energy (DOE) to invest in its ...

X-FAB Silicon Foundries has launched XSICM03, its next-generation XbloX platform, advancing SiC process technology for power ...

US superconducting quantum computing startup Qolab has raised over $16.0m for its scalable quantum supercomputer technology ...

This new laser addresses that gap, making it compatible with the conventional CMOS technology for chip fabrication and ... Grown on standard silicon wafers like those used for silicon transistors ...

By S.G. Vombatkere Karnataka’s State High-level Clearance Committee cleared establishment of Karnataka’s first semiconductor ...

U.S. government and GlobalWafers finalize $406 million deal to build 300mm wafer production facility in Missouri ...

under the CHIPS Incentives Program's Funding Opportunity for Commercial Fabrication Facilities ... to onshore a domestic source for silicon wafers - the foundation for all chips and an end ...

facilitating the fabrication of a greater number of individual chips on a single 300 mm wafer when compared to smaller counterparts. These 300 mm silicon wafers play a pivotal role in the manufacture ...