LG Innotek has begun mass production of its flip chip ball grid array semiconductor substrate for U.S. clients.

JPII fired former coach Brian Sneed in November after a 4-7 season that ended against Lausanne in the Division II-AA first ...

Damian Palanyandi came out best in challenging conditions to win the Bermuda Golf Association January Medal at Tuckers Point ...

As a team, the BGA girls took fifth in the 4x200 relay with a team of Alaysia Thomas, Appalonia Bushaw, Brenna George, and Elanor Sprow before excelling in individual events. Maddie Ingham led the ...

Women in the Web3 gaming industry are more hopeful about blockchain gaming taking off in the next year compared to men, according to the Blockchain Gaming Alliance (BGA). “Female respondents ...

在芯片封装技术快速发展的今天，激光钻孔设备正承载着越来越多的技术创新与市场需求。日前，英诺激光发布了其面向先进封装的超精密激光钻孔设备，该设备的推出使得FC-BGA封装的ABF载板超精密钻孔技术迈上了新的台阶，标志着激光技术在半导体制造领域的又一次突 ...

金融界2025年1月8日消息，国家知识产权局信息显示，海普半导体（武汉）有限公司新近获得了一项突破性专利，名为“一种微小球BGA锡球筛选机”，授权公告号为CN222287908U。该专利的申请日期为2024年5月，该产品不仅为电子制造行业注入了新活力 ...

每经AI快讯，有投资者在投资者互动平台提问：请问公司CBF产品是否出货 ...

深南电路近日在接受调研时表示，公司FC-BGA封装基板已具备16层及以下产品批量生产能力。 此内容为第一财经原创，著作权归 ...

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